Abstract: We propose a novel Si photonics module that overcomes the issues of conventional Si photonics modules such as package structure and electrical connection. The module incorporates an optical ...
Abstract: It is increasingly important for the next-generation exascale supercomputers to extend its applications beyond traditional high-performance computing (HPC) scenarios, so as to achieve high ...
The kernel is the part of the operating system that facilitates interactions between hardware and software components. On most systems, it is loaded on startup after the bootloader and handles I/O ...
Chip programming solutions provider Data I/O was recently targeted in a ransomware attack that has caused significant disruption to the company’s operations. Data I/O offers electronic device ...
ACCES I/O Products is pleased to announce the release of its newest Ethernet-based data acquisition computer solution—the eNET-AIO16-16F. This standalone, high ...
Accelerate your tech game Paid Content How the New Space Race Will Drive Innovation How the metaverse will change the future of work and society Managing the ...
1 School of Mechanical and Power Engineering, Zhengzhou University, Zhengzhou, China 2 Department of Nephrology, People’s Hospital of Zhengzhou University, Zhengzhou, China The assessment of vascular ...
X/Twitter will soon be making more changes to the block button, with CEO Elon Musk confirming that all public posts will be viewable going forward, even to those who have been blocked. Nima Owji was ...
SolidRun has recently introduced the “Ryzen V3000 CX7” x86-based CoM Express 7 module powered by an AMD Ryzen V3000 Series V3C48 or V3C18I APU. This module is designed with AMD’s 6nm ‘Zen3’ ...
Bill Lydon discusses the benefits of OPAF’s using existing standards rather than falling into the “we are different” trap and creating new standards. The Open Process Automation Forum™ standard ...
LB remote I/O system for Zone 2/Div. 2 is an energy-saving power management solution with low power dissipation that allows maximum packing density. Its high-performance modules are plugged into a ...
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